Wuxi Lepower Breaks Ground on Automotive-Grade SiC Module Facility in Yangzhou, Set for 2027 Production

On March 29, Wuxi Lepower Semiconductor Co., Ltd. officially broke ground on its Yangzhou production base. The project represents a total investment of RMB 180 million, covers an area of 32 mu (approximately 21,300 square meters), and is designed for an annual output of 3 million IGBT/SiC modules. The first phase will include two automotive-grade SiC packaging and testing production lines, with mass production scheduled to begin in March 2027, achieving an annual capacity of 1.5 million units. The facility will integrate over 100 pieces of equipment and a MES system to enable automated and digitalized manufacturing. Founded in 2019, Lepower specializes in the R&D and production of SiC power modules and has developed more than 300 product models, exporting to over 20 countries. In mid-March, the company secured a Pre-B+ round of financing worth hundreds of millions of RMB, led by Yangzhou Guojin Investment and others, to support the construction of the new base and market expansion. On the same day as the groundbreaking ceremony, Lepower launched four new products and signed strategic cooperation agreements with multiple enterprises. Chairman Ding Xuanming stated that the company will focus on sectors such as heavy-duty trucks and aims to become a leading global supplier of SiC modules.