GAC Tech Day 2026 Set for April 12 to Unveil Next-Gen Hybrid Tech, Smart Cockpit, and E/E Architecture

GAC Group announced that its 2026 GAC Tech Day, themed “Technology with a Human Touch,” will be held on April 12 at its Panyu headquarters. The event will unveil the company’s next-generation electronic and electrical (E/E) architecture for the first time and showcase innovative advancements including new plug-in hybrid electric vehicle (PHEV) and hybrid electric vehicle (HEV) technologies, as well as an integrated cloud-edge intelligent cockpit system. The new PHEV technology, built on a highly integrated hybrid system with coordinated hardware and software, enables vehicles weighing around 2 tons to achieve fuel consumption in the 3-liter-per-100-km range. It delivers wheel-end total torque exceeding 10,000 N·m for all-wheel-drive systems and accelerates from 0 to 100 km/h in under 4 seconds. The new HEV technology, branded HEV+, retains the advantages of conventional hybrid systems while eliminating range anxiety and preserving users’ familiar refueling habits. It also introduces new features such as extended parking-mode power supply, sentry mode, and seamless over-the-air (OTA) vehicle updates. The next-generation intelligent cockpit adopts a unified cloud-edge architecture, featuring continuous learning capabilities and advanced understanding of complex scenarios. It supports multimodal perception and enables comprehensive active safety protection across all driving situations directly on the vehicle’s edge side, proactively identifying risks and safeguarding occupants. Additionally, it incorporates emotional cognition and expression capabilities to offer mood-aware interactions and companionship. Through collaboration with leading AI technology companies, the cockpit will integrate a full-scenario service ecosystem covering dining, accommodation, transportation, tourism, shopping, and entertainment. Furthermore, GAC will publicly debut its next-generation E/E architecture for the first time, claiming industry-leading performance in communication speed and system responsiveness. The company will also unveil automotive-grade chips co-developed with domestic partners.