Bosch Surpasses 10 Million Global Deliveries of Smart Cockpits, Advancing AI Cockpit and Central Computing Platform Strategy

Bosch’s intelligent cockpit solution, developed based on Qualcomm’s Snapdragon Cockpit Platform, has surpassed 10 million units in cumulative global deliveries. The solution debuted in 2021 with a smart cockpit domain controller powered by Qualcomm’s SA8155P chip and achieved one million unit deliveries in 2023—marking a tenfold increase in shipments within three years. In 2024, Bosch launched its second-generation domain-fusion solution, which supports cockpit-driving integration and incorporates components such as a fused gateway and T-Box, enabling cross-domain collaboration. As of October 2025, this intelligent cockpit solution has secured more than 100 mass-production and development projects, covering over 20 vehicle models from five leading Chinese automotive brands and supporting their expansion into overseas markets. Bosch leverages a comprehensive toolchain and its “global delivery + local insights” capabilities to enable large-scale deployment. Building on its experience from delivering tens of millions of units, Bosch plans to launch its third-generation AI-powered intelligent cockpit platform in 2025. Centered around a high-performance AI chip, the platform will offer a flexible AI Box configuration. Featuring an “edge-cloud协同” (edge-cloud collaborative) AI architecture, it delivers millisecond-level response times; through deep integration with AI.OS, it enables proactive services; and by combining high-performance computing power with full-stack integration capabilities, it aims to create an all-scenario intelligent mobility ecosystem. Additionally, Bosch plans to introduce an AI-driven central vehicle intelligence brain in 2026, achieving full-domain AI fusion and further elevating the intelligent mobility experience.