Domestic Smart Driving Chips Break Through in Computing Power, Multiple Automakers Launch or Co-Develop 1,000+ TOPS Solutions

Multiple Chinese automakers and chip companies are accelerating the development and deployment of high-computing-power AI chips. XPeng has unveiled its Turing AI chip with a single-chip computing power of 750 TOPS; NIO introduced the Shengji NX9031 chip offering 1,000 TOPS per chip; and Li Auto launched its self-developed Mach M100 chip, delivering 1,280 TOPS per chip, which will debut on the new Li L9 Livis. The Mach M100 adopts a dataflow architecture—distinct from the traditional von Neumann architecture—to enhance computational efficiency. In addition to in-house development, some automakers are partnering with domestic chip suppliers. Horizon Robotics has rolled out the Journey J6P with 560 TOPS and further introduced the "Stellar J6P," a cabin-and-driving integrated chip offering 650 TOPS, supporting unified operation of cockpit and autonomous driving functions. At the Beijing Auto Show, Black Sesame Intelligent unveiled its Huashan A2000 series chips, with the A2000X variant delivering 1,000 TOPS per chip. It supports dual-chip interconnection for scalable computing power and employs a "near-memory architecture" to reduce memory costs. Tesla’s latest AI5 chip has completed tape-out, boasting 2,000–2,500 TOPS of computing power. Mass production is scheduled for 2027, with initial applications focused on the Optimus humanoid robot and Tesla’s supercomputing centers; no vehicle integration plans have been announced yet. Today, intelligent driving chips have generally entered the thousand-TOPS era. Domestic chipmakers are continuously advancing in architectural innovation and system integration, enabling China’s local supply chain to transition from follower to leader in the race toward automotive intelligence.