BYD Claims Sole Automaker with Full-Chain Chip Manufacturing Capability

BYD will hold an intelligent technology strategy launch event on the evening of May 28. Ahead of the event, Li Yunfei, General Manager of BYD Group’s Brand and Public Relations Division, revealed that the content of this launch has been in preparation for a long time. Chairman and President Wang Chuanfu’s presentation materials span over 40 pages, with 13 pages dedicated specifically to chips and semiconductor-related topics. According to Li, BYD is the world’s only automaker with full-process chip manufacturing capabilities—covering product definition, architecture design, circuit design, layout design, wafer fabrication, packaging, and chip testing. Its semiconductor products serve multiple sectors, including photovoltaic energy storage, industrial equipment, home appliances, consumer electronics, and smart vehicles. To date, BYD has launched 566 automotive-grade chip products and will unveil its 567th at this event.