2026 Automotive Thermal Management Innovation Forum Hosts Multi-Industry Supply Chain Matchmaking Event

On June 24, 2026, the 4th Automotive Thermal Management Full-Scenario Innovation & Development Forum and its concurrent Procurement & Sourcing Fair will be held in Shanghai. The event focuses on the full-scenario applications of thermal management technologies across sectors including new energy vehicles, intelligent robots, low-altitude aircraft, and AI computing centers. It aims to break down technical and supply chain barriers among emerging industries—such as automotive, robotics, the low-altitude economy, and data centers—and foster integration and efficient collaboration across the entire industrial chain. To date, more than ten buyers have confirmed participation, including well-known foreign commercial vehicle manufacturers, luxury automakers, leading domestic OEMs, and high-quality robotics companies. These buyers have announced procurement needs spanning core and emerging components such as thermal management integrated modules, compressors, heat exchangers, water pumps, battery cooling plates, electric fans, automotive-grade sensors, power semiconductor cooling devices, robotic joint cooling solutions, data center liquid cooling systems, and high-RPM ducted fans. Participating enterprises will engage in one-on-one in-depth discussions with buyers on topics including technology sharing, product co-development, supply-demand matching, and technological upgrades, exploring pathways to extend thermal management solutions from automotive applications to cross-industry collaborative use cases. Together, they aim to build a secure, efficient, and reliable next-generation industrial supply chain. Registration for the event is now open.