BYD Secretary Li Qian Says Company Will Continue Investing in Semiconductors; Xuanji A3 Chip Enters Mass Production

On September 16, BYD held an executive-to-shareholder engagement event at the Shaoxing Raceway. Li Qian, Secretary of the Board and General Manager of the Investment Department at BYD Group, stated during the event that BYD offers 567 automotive-grade chip products across 13 major categories, ranging from power semiconductors to analog chips, and will expand into logic chips in 2026. BYD Semiconductor possesses full-chain capabilities covering chip design, wafer fabrication, packaging, and testing. Li revealed that BYD will continue achieving breakthroughs in semiconductor design and production and maintain strong investment and focus in this field. The Xuanji A3 chip, launched in 2026, is China’s first automotive-grade 4nm intelligent driving chip and has already entered mass production. In May 2026, BYD officially unveiled its self-developed Xuanji A3 chip, which supports L3 and L4 autonomous driving. The combined computing power of three such chips exceeds 2,100 TOPS, and with BYD’s proprietary algorithm optimization, computational efficiency has doubled. At the May launch event, Wang Chuanfu disclosed that BYD established its IC Design Department—the predecessor of BYD Semiconductor—in 2002. To date, BYD has launched over 2,000 chip products, spanning smart vehicles and consumer electronics. The company currently operates five wafer fabs and controls all seven key steps: product definition, architecture design, circuit design, wafer manufacturing, packaging, and testing.