Home: Motoring > Infineon and Qualcomm Sign Agreement to Integrate MCU Subsystem into Snapdragon Ride/Ride Flex Automotive Platform

Infineon and Qualcomm Sign Agreement to Integrate MCU Subsystem into Snapdragon Ride/Ride Flex Automotive Platform

From:Internet Info Agency 2026-11-03 10:33:11

On November 2, Infineon announced a collaboration with Qualcomm to accelerate the development and deployment of SDV (software-defined vehicle) central in-vehicle computers. Under the agreement signed by both parties, Qualcomm's Snapdragon Ride/Ride Flex reference platform will integrate subsystems powered by Infineon MCUs (microcontrollers). This integration combines Qualcomm's platform capabilities and high-performance SoCs with Infineon's software and hardware expertise in safety management, connectivity, and memory management. As a complement to the Snapdragon Ride/Ride Flex reference platform, Infineon's MCU subsystem provides system health monitoring, safety mechanism coordination, and predictable real-time control of critical safety functions. In addition to AURIX MCU and OPTIREG PMIC hardware, Infineon also provides software packages including firmware and safety monitoring software.

Editor:NewsAssistant