Recently, Zhejiang Jingneng Microelectronics Co., Ltd. completed a Series C financing round of RMB 630 million. This marks the company's fifth round of funding since its establishment four years ago, bringing its total raised capital to nearly RMB 2 billion. Jingneng Microelectronics initially focused on automotive-grade SiC modules and has since expanded its business into areas including data centers, aerospace, and controlled nuclear fusion. On the product front, the company has built a comprehensive portfolio encompassing automotive-grade power modules, AI-grade SST modules, embedded SSCB modules, and multi-chip tantalum capacitors. The proceeds from this round will be allocated toward iterative R&D of core products, production line construction, and upgrades to reliability validation platforms. The funds will also support market expansion, the implementation of benchmark projects across various sectors, and the enhancement of upstream and downstream industrial collaboration.