Quectel Unveils Full-Range Automotive AI Solutions at Qualcomm Auto Summit 2026, Advancing Cockpit Connectivity and On-Device Large Models

From June 4 to 5, 2026, the Qualcomm Automotive Technology and Collaboration Summit, themed “Intelligence Ignites a New Journey,” was held at the Wuxi International Convention Center. Global OEMs, Tier 1 suppliers, and automotive supply chain companies gathered to discuss trends in intelligent vehicle development. As Qualcomm’s long-term strategic partner, Quectel showcased its comprehensive suite of intelligent automotive solutions spanning three key dimensions: computing foundation, AI brain, and perception & connectivity. Meng Pu, Chairman of Qualcomm China, stated in his opening remarks that vehicles are evolving into highly intelligent mobile spaces and will become a critical platform for AI agents. Qualcomm will leverage its Snapdragon Digital Chassis to collaborate with Chinese automotive ecosystem partners to accelerate this intelligent transformation. Wang Min, General Manager of Quectel’s Automotive OEM Business Unit and President of Ruitong Smart Mobility, delivered a keynote speech highlighting that the industry has entered an AI-native era, with cockpit-infotainment convergence and on-board deployment of large AI models emerging as key trends. Quectel and Qualcomm continue to deepen their collaboration to drive the extensive application of connectivity and computing technologies in the automotive sector. In terms of computing foundation, Quectel has launched an integrated cockpit-infotainment convergence solution portfolio based on multiple Qualcomm chips, addressing requirements from entry-level to flagship vehicle segments. Among them, the AS900P solution—powered by Qualcomm’s QCM8838 chip built on a 3nm process—delivers 300K DMIPS CPU performance and 64 TOPS NPU AI computing power. It has already passed GB/T 32960.2 certification and has been selected by multiple automakers for high-end vehicle models. Additionally, the AS830M (based on QCM8538) and AS700E (based on QCM6650) target the mid-to-high-end and economy segments respectively, catering to diverse market needs. Quectel is also developing new solutions based on chips such as the QCS9075. On the AI brain front, Quectel introduced a scalable, edge-based large-model automotive solution supporting mainstream models including Qwen, DeepSeek, and Llama. Integrated with Quectel’s proprietary memory engine, it enables personalized data storage and automatic user-profile switching, significantly enhancing human-vehicle interaction experiences. In perception and connectivity, Quectel offers a full spectrum of products ranging from LTE Cat 4 to 5G Release 18 (5G-A). Its next-generation 5G R18 NAD products support high-bandwidth, low-latency transmission, while its CV2X solutions are already in mass production, empowering advanced intelligent driving scenarios when combined with high-precision positioning. On-site demonstrations included the NIO ES8 and ES9 equipped with Quectel’s AG591E 5G modules, and the Li Auto L9 Livis featuring the AG591H 5G-A module. Quectel also unveiled ten additional automotive solutions—including digital key, millimeter-wave radar, and smart antennas—to build an integrated architecture combining cellular communication, direct connectivity, high-precision positioning, and environmental sensing. Quectel emphasized its commitment to working closely with Qualcomm and ecosystem partners to advance the automotive industry’s evolution toward intelligent mobile spaces.