NXP Breaks Ground on New Malaysian Assembly and Test Facility, Targeting Q1 2028 Production

Recently, NXP Semiconductors held a groundbreaking ceremony for a new packaging and testing facility in Petaling Jaya, Malaysia. The new plant is an expansion of NXP’s existing assembly and test site, adding approximately 500,000 square feet of production space and bringing the site’s total manufacturing area to around 900,000 square feet upon completion. Designed as a highly automated smart factory, the new facility is expected to begin ramping up production in the first quarter of 2028 and, once fully operational, will more than double the site’s total output. It will be equipped with automated material handling systems and advanced quality management technologies. This project is part of NXP’s hybrid manufacturing strategy, aimed at enhancing supply chain resilience, flexibility, and geographic diversification. The expanded Petaling Jaya site will complement NXP’s existing assembly and test facilities in Greater China, Thailand, and other regions. NXP has operated in Malaysia since 1972, and this site serves as a critical hub in its global supply chain. Additionally, NXP is collaborating with local universities to cultivate semiconductor talent.