From：Internet Info Agency 2026-08-24 21:09:19
On August 24, Lei Jun, founder, chairman, and CEO of Xiaomi, announced that September would be Xiaomi’s “Big Tech Month.” At the beginning of the month, Xiaomi will officially launch its new Pengcheng series of vehicles alongside the Xiaomi 18 Fold. At the end of the month, the Xiaomi 18 Pro series will be unveiled. On the same day, Xiaomi introduced its next-generation Xuanjie chips, comprising three new products: - The Xuanjie O3 is an AI flagship SoC with an AnTuTu benchmark score of 5.22 million; - The Xuanjie O100 is a high-bandwidth AI acceleration chip offering 1.22 TB/s bandwidth; - The Xuanjie D100 is China’s first 3nm high-performance AI chip for intelligent driving. The Xiaomi 18 Fold will be the first device to feature the Xuanjie O3 processor, and the Xiaomi Pad 9 Pro Max will also launch simultaneously with this chip. The Xuanjie O3 features a 10-core all-big-core CPU design, delivering a multi-core score exceeding 15,000—60% higher than its predecessor. Its GPU uses the G2-Ultra NX graphics processor, boosting performance by 85% while reducing power consumption by 64%. It supports LPDDR6 memory with a bandwidth of 113.8 GB/s, a 48% increase over the Xuanjie O1. The chip’s NPU architecture is specifically optimized for Xiaomi’s MiMo on-device large models, providing 200 TOPS of tensor compute power and 3.13 TFLOPS of vector compute power, resulting in a 45% improvement in on-device AI performance. Additionally, AI acceleration units are integrated into its CPU, GPU, ISP, DPU, and ADSP modules.
