From：Internet Info Agency 2026-08-29 12:12:00
The rapid development of artificial intelligence (AI) is significantly driving demand for copper. AI servers require stronger power delivery, faster data transmission, and more efficient heat dissipation due to their high-speed computing needs—areas where copper plays a critical role. Market estimates indicate that by 2026, global demand for high-end copper foil specifically used in AI servers will reach approximately 24,000 metric tons, representing a year-over-year increase of about 260%. Each high-performance AI server uses 15 to 30 kilograms of copper—three to six times the amount used in a standard server. The accelerating adoption of liquid cooling technologies further boosts copper usage, as its superior thermal conductivity makes it ideal for components like liquid cooling plates. As AI servers demand ever-faster data transmission speeds, performance requirements for copper materials are rising accordingly. A company based in Chizhou, Anhui Province, produces ultra-low-profile (ULP) copper foil for high-speed printed circuit boards (PCBs) in AI servers, achieving a surface roughness of less than 2 micrometers—enabling a 70% improvement in signal transmission speed compared to conventional copper foil. Since Q4 2023, high-end copper foil used in computing infrastructure has remained in tight supply, pushing processing premiums up by 30% to 50%. In 2024, prices for ULP copper foil tailored for AI servers and high-speed computing equipment have risen by approximately 10% to 30%. The market forecasts that global demand for high-end copper foil dedicated to AI servers will grow to around 50,000 metric tons by 2027 and could exceed 110,000 metric tons by 2030. Morgan Stanley predicts that global copper demand from data centers will reach 1.3 million metric tons by 2028—double the 2026 level—with growth driven by internal AI server components, liquid cooling systems, high-speed connectors, and power infrastructure.
