Runxinwei, Unisoc, and Datong Auto Mass-Produce Domestic Smart Cockpit Solution; A7870 Chip Makes Commercial Vehicle Debut

On April 2, Runxinwei, Unisoc, and SAIC Maxus held a joint mass production launch and strategic cooperation signing ceremony in Shanghai, officially announcing that their co-developed domestic intelligent cockpit solution has entered mass production across multiple Maxus vehicle platforms. This collaboration marks the successful implementation of a deeply integrated “chip-cockpit-vehicle” full-chain synergy model, establishing China’s first domestically developed intelligent cockpit benchmark project in the commercial vehicle sector and accelerating the industry’s intelligent transformation and supply chain autonomy. At the core of this mass production solution is Unisoc’s A7870 automotive-grade intelligent cockpit chip platform. Built on advanced process technology and certified under the AEC-Q100 automotive standard, the chip delivers high computing power, high integration, low power consumption, and exceptional stability. It supports multi-channel high-definition display outputs and multiple camera inputs, fully meeting the stringent mass production requirements of commercial vehicles in complex scenarios such as intelligent cockpits, integrated cabin-parking systems, and connected vehicle applications. Notably, this marks the first large-scale deployment of the A7870 chip in the commercial vehicle segment and represents a significant breakthrough for Unisoc’s automotive-grade solutions in achieving multi-model, platform-based mass production at OEMs—demonstrating the maturity and broad adaptability of its technology. As a provider of integrated hardware-software solutions, Runxinwei played a pivotal role in bridging the gap between chip and vehicle, handling critical adaptation and engineering implementation tasks. Leveraging its C200 intelligent cockpit platform—built upon the “ZhiRun + ZhiWei + ZhiXin” intelligent foundation—Runxinwei developed a customized solution specifically for commercial vehicles based on Unisoc’s A7870 chip. The company completed end-to-end integration across the entire stack, including底层 driver adaptation, OS optimization, performance tuning, intelligent interaction design, and vehicle control services, effectively resolving key challenges in aligning domestic chips with commercial vehicle mass production. The platform supports both split-screen and integrated display configurations and is compatible with mainstream smartphone connectivity protocols, covering over 93% of smartphones globally. Thanks to its mature mass production delivery system, global compliance capabilities, and high reliability, Runxinwei successfully enabled rapid intelligent cockpit deployment across multiple Maxus commercial vehicle models—marking its first large-scale commercial vehicle mass production based on a domestic chip platform following earlier successes in the passenger car segment. Maxus, leveraging its core product lines—including wide-body light vans and pickup trucks—completed vehicle-level integration, testing validation, and volume manufacturing of the intelligent cockpit solution, providing an excellent terminal application scenario and global market support to accelerate the conversion of intelligent technologies into tangible product competitiveness. During the event, the three parties also formally signed a strategic cooperation agreement, committing to build a deeply integrated domestic “chip-cockpit-vehicle” industrial ecosystem centered on full-chain collaboration in chip development, system adaptation, and vehicle mass production: Unisoc strengthening the hardware foundation, Runxinwei enabling software and engineering implementation, and Maxus closing the loop through large-scale terminal deployment. By combining their complementary strengths, the trio aims to jointly address the long-standing industry pain points of “chip shortages and software gaps” in commercial vehicle intelligence and accelerate the widespread adoption of domestically developed technologies. Looking ahead, the three partners will take this mass production milestone as a new starting point to deepen collaboration in automotive-grade chips, intelligent cockpits, cabin-driving integration, edge AI, and global market adaptation—advancing joint R&D, product iteration, and ecosystem co-construction. Runxinwei will continue to serve as a neutral industry connector, leveraging its highly localized, reliable, and efficient hardware-software integrated solutions to closely collaborate with Unisoc and other ecosystem partners, accelerating the large-scale deployment of domestic chips and intelligent hardware across more vehicle models and jointly building a safe, intelligent, and autonomous mobility ecosystem.