TI Unveils New Isolated Power Module with 3x Higher Power Density

On March 23, Texas Instruments (TI) introduced two new isolated power modules, the UCC34140-Q1 and UCC33420, leveraging its proprietary IsoShield multi-chip packaging technology to deliver three times the power density of traditional discrete solutions. Designed for demanding applications such as data centers and electric vehicles, these modules significantly enhance efficiency, safety, and reliability. TI stated that IsoShield technology enables engineers to develop smaller, higher-performance power solutions with faster time-to-market, further advancing power semiconductor innovation.