China's First Automotive-Grade, Advanced-Process, Multi-Domain Fusion Chip "Hongqi-1" Successfully Developed

FAW Group's R&D General Institute, in collaboration with industry partners, has successfully developed China's first domestically produced automotive-grade, advanced-process, multi-domain integrated chip—the "Hongqi No.1." Designed for intelligent vehicle central computing architectures, this chip integrates five major functional domains—driver assistance, intelligent cockpit, body and chassis control, communication, and security—onto a single chip, achieving integrated "cockpit-driving-control" functionality. Compared to mainstream domain-integrated chips in the industry, the Hongqi No.1 delivers a 21.7% improvement in logical computing performance and a 15.4% boost in image processing capability. It supports complex cockpit scenarios featuring "one-chip-multiple-displays and concurrent multi-operating-system operation," while reserving computational headroom for future integration of high-end intelligent cockpits and autonomous driving functions. The chip incorporates an independent security island with hardware-level isolation capabilities, meeting the highest functional safety standard ASIL-D and China’s National Cryptography Level 2 information security requirements, ensuring critical control signals remain intact and the system stays operational even under extreme fault conditions. The development of this chip reduces reliance on imported high-end automotive-grade chips. By integrating multiple domains into a single chip, it decreases the number of electronic control units (ECUs) and wiring harness complexity in vehicles, helping lower system costs and development cycles, while enhancing automakers' resilience against global semiconductor price volatility.