Beijing Auto Show Highlights Accelerated Mass Production of Cockpit-Driving Integration with Deep Involvement of Domestic Chipmakers

At this year's Beijing Auto Show, cabin-driving integration has moved beyond the technology validation phase and entered large-scale mass production, becoming a key strategic focus for mainstream automakers. Multiple carmakers showcased vehicles based on centralized computing platforms featuring integrated cabin and driving architectures. Leapmotor’s new flagship SUV, the D19, made its debut equipped with dual Qualcomm Snapdragon Ride™ 8795 (SA8795P) central domain controller chips; XPeng has implemented cabin-driving integration in its core models; and traditional automakers such as Chery, BAIC, and Dongfeng are also advancing related vehicle launches through partnerships with chip companies. Amid this trend, China’s domestic chipmakers are stepping out from behind the scenes into the spotlight. Horizon Robotics unveiled its cabin-driving integrated automotive-grade AI chip featuring a safety-isolated architecture, securing collaboration intentions from multiple automakers. Black Sesame Technologies jointly developed the “Tianyuan Smart Cockpit Plus” with Dongfeng, leveraging its self-developed chip to achieve multi-domain integration. SiEngine Technology launched its “Dragon Eagle II” chip, designed to serve as a central computing hub. Automotive suppliers like Bosch and Chehe Tech are also actively participating, translating chip computing power into practical engineering solutions. Although Chinese chipmakers still face competition from international players like Qualcomm and NVIDIA in the premium segment, domestically produced chips have already emerged as a significant force in cabin-driving integration and are now at an early stage of transitioning from “usable” to “optimized for performance.”