Multiple Automakers and Supply Chain Firms Launch RISC-V Automotive Chip Committee

On April 26, 2026, at the China Automotive Chip Pavilion of the Beijing Auto Show, the China Automotive Chip Industry Innovation Strategic Alliance officially established the RISC-V Automotive-Grade Chip Special Committee. The committee was jointly initiated by leading automakers—including Dongfeng Motor, Great Wall Motor, GAC Group, FAW Group, and BYD—together with semiconductor and IP companies such as Infineon, Suzhou C-Core, Zijing Semiconductor, Binary Semiconductor, and Nuclei System Technology, as well as institutions like Jingwei Hengrun, Neusoft Reach, China Automotive Innovation Intelligence, Puhua Basic Software, National Innovation Center for Intelligent and Connected Vehicles, and Shanghai Intelligent Automotive Software Park. It encompasses the entire automotive chip industry chain, covering automotive electronics, chip design, manufacturing, testing and certification, and software toolchains. Previously, in August 2025, the Alliance had already formed a RISC-V Automotive-Grade Chip Working Group to conduct technical and ecosystem research, culminating in the completion of the report "Research on RISC-V Automotive-Grade Chip Technologies and Ecosystem Framework." This report was formally published and distributed to contributing organizations and industry experts during the committee’s inauguration ceremony. The Special Committee aims to drive large-scale adoption of the RISC-V architecture in intelligent vehicles by focusing on foundational architectural innovation and deep hardware-software co-optimization for automotive-grade applications. It will foster an open and collaborative industrial ecosystem, build consensus among stakeholders on technical roadmaps, competitive advantages, and application scenarios, and accelerate the deployment of high-performance RISC-V chips in automotive systems.