From:Internet Info Agency 2026-04-30 17:52:07
During the 2026 Beijing International Automotive Exhibition, Shenzhen Hangsheng Electronics Co., Ltd. unveiled three core technological achievements: the Kongming 3.0 Advanced Intelligent Driving Solution, the DSSAD High-Safety and High-Reliability Autonomous Driving Data Recording System, and the Mozi 3.0 Computing Platform combined with the Moyuan AIOS full-stack hardware-software solution. These technologies aim to drive intelligent vehicles from functional capabilities toward greater intelligence and proactive performance. On the same day (April 25), Hangsheng signed a Strategic Cooperation Memorandum of Understanding (MoU 2.0) with NXP Semiconductors. The two companies plan to jointly establish "Joint Innovation Centers" in multiple locations, focusing on collaborative R&D in key areas. Founded 33 years ago, Hangsheng Electronics has grown into a leading enterprise in China's automotive electronics industry.

Tesla Launches Virtual Queue System for Superchargers to Streamline Charging
BYD Dynasty Network's First D-Class Flagship SUV, Tang EV, Surpasses 30,000 Pre-Orders in 24 Hours
Momenta R7 Launches World Model with Reinforcement Learning, Bringing Physical AI to Scale
Xiaomi SU7 Max Sets Fastest Lap for Sub-¥500K Four-Door Production Car at Zhejiang Circuit
Xiaomi Auto Unveils Global Expansion Plan: Entering Germany by 2027, Targeting 411,000 Sales in 2025
Dongfeng Fengxing V6 Debuts at 2026 Beijing Auto Show with Huawei Qiankun Smart Driving System
Toyota HiAce Set for First Redesign in 22 Years: Bold New Look, Front-Engine Layout, Hybrid Option