Ouye Semiconductor Secures Hundreds of Millions in Series C Funding to Accelerate AI Chip Mass Production and Multi-Sector Expansion

On May 6, Ouye Semiconductor announced the completion of its Series C financing round, raising several hundred million RMB. The round was jointly invested by SDIC Capital, the Shenzhen “20+8” New Energy Vehicle Fund managed by Shenzhen Investment Holdings and Cornerstone Asset Management, Nanshan Strategic Emerging Industries Investment, and Binfu Capital. The proceeds will be used to strengthen R&D capabilities, accelerate product mass production, and expand into multiple industry markets. Focusing on core technologies including perception, computing, communication, interaction, and display, the company has built a unified chip technology platform and launched AI chip series such as Longquan, Gongbu, and Chunjun, forming a comprehensive solution matrix covering diverse application scenarios. Leveraging a unified architecture encompassing algorithms, chips, and software, Ouye Semiconductor has expanded its business from intelligent vehicles into smart industrial systems, robotics, and broader AIoT domains. In the intelligent automotive sector, the company offers edge-side intelligent components centered around advanced driver-assistance systems (ADAS), intelligent zone control units (ZCUs), AI-powered automotive lighting, and AI XMS solutions. It has secured定点 awards for dozens of projects from multiple leading automakers, with related products progressively entering vehicle mass production. In smart industry and robotics, Ouye provides real-time computing power for embodied robots, industrial vision, motion control, and autonomous navigation. Additionally, its products are deployed in smart two-wheeled electric vehicles and innovative smart hardware within the broader AIoT ecosystem, driving intelligent upgrades for end devices. Following this financing round, Ouye Semiconductor will further solidify its “Everything+AI” technological capabilities, accelerate large-scale product delivery, and deepen its strategic footprint across intelligent vehicles, smart industry and robotics, and the wider AIoT landscape—providing foundational chip-level support for the intelligent transformation of the physical world.