BAIC Group and Tsinghua Unigroup Sign Strategic Partnership to Advance Automotive-Grade Chips and Smart Vehicle Technologies

On May 18, BAIC Group and Tsinghua Unigroup signed a strategic cooperation agreement, under which the two parties will collaborate in five key areas: automotive-grade chips, intelligent cockpits, autonomous driving, industrial investment, and vehicle-cloud ecosystems. Concurrently, they also signed three specialized agreements. According to the agreement, BAIC Group will leverage its strengths in vehicle R&D, manufacturing, and scenario-based applications, while Tsinghua Unigroup will contribute its technological capabilities in chip design, computing power, information security, and digital infrastructure. Together, they aim to build a comprehensive cooperation framework covering joint technological innovation, supply chain security, industrial investment, ecosystem co-construction, and procurement services. Key collaboration priorities include jointly developing critical systems such as intelligent cockpits, intelligent driving, and vehicle control units; accelerating the large-scale adoption of domestically produced chips in BAIC vehicles; and enhancing the security and stability of the supply chain. On the same day of the signing ceremony, BAIC Group’s Research Institute, UNISOC, and Unigroup ZhiXing jointly signed an agreement for the Intelligent Cockpit All-in-One project, aiming to develop cockpit products featuring high computing power, high reliability, and high security. Additionally, BAIC Capital Investment and Unigroup OT signed an investment framework agreement to pursue strategic investments focused on the “vehicle-chip synergy” industrial cluster, supporting Beijing’s ambition to become a world-class hub for intelligent automotive and semiconductor innovation.