BAIC Group and Tsinghua Unigroup Sign Strategic Partnership to Advance Automotive-Grade Chips and Smart Vehicle Technologies

On May 18, BAIC Group and Tsinghua Unigroup held a strategic cooperation signing ceremony, deepening collaboration in automotive-grade chips, intelligent cockpits, autonomous driving, industrial investment, and vehicle-cloud ecosystems. Three agreements were signed concurrently. Leveraging BAIC’s strengths in vehicle R&D, manufacturing, and scenario-based applications, along with Tsinghua Unigroup’s capabilities in chip design, computing power, information security, and digital infrastructure, the two parties will establish a comprehensive cooperation framework covering joint technological innovation, supply chain security, industrial investment, ecosystem co-construction, and procurement services. Key initiatives include co-developing critical systems such as intelligent cockpits, intelligent driving, and vehicle control units, accelerating the large-scale adoption of domestically produced chips in BAIC vehicles, and enhancing the security and stability of the automotive supply chain. BAIC Research Institute, UNISOC, and Unigroup ZhiXing have already signed an agreement for a smart cockpit all-in-one project, aiming to deliver a high-computing-power, highly reliable, and secure cockpit experience. Additionally, BAIC Industrial Investment and Unigroup OT have signed an investment framework agreement to build an integrated “vehicle-chip synergy” industrial cluster, supporting Beijing’s ambition to become a world-class hub for intelligent vehicle and semiconductor innovation.