ECARX and Arm Sign Memorandum of Understanding to Jointly Develop Next-Generation High-Performance AI Computing Platform

On November 2, 2026, ECARX Holdings announced the signing of a non-binding memorandum of cooperation with Arm. The two parties will establish a cooperation framework to jointly explore and develop next-generation high-performance AI computing platforms for the mobility sector and cross-industry scenarios. Under the memorandum, the two parties will conduct joint system-level engineering development covering system-level architecture definition, performance tuning, software adaptation, functional safety, toolchain and cybersecurity validation, while simultaneously advancing industrial ecosystem co-building. Teams from both sides will refine customized technical solutions for the Chinese and global markets, expanding beyond mobility scenarios to cross-industry physical AI applications such as AI terminals. ECARX stated that Arm will serve as a core partner supporting ECARX in building computing solutions capable of handling physical AI computing workloads across mobility and diverse cross-industry scenarios. The two parties had previously collaborated through SiEngine Technology. SiEngine's 7nm automotive-grade intelligent cockpit chip "Longying No. 1" has achieved mass production, with cumulative shipments exceeding one million units. According to official sources, the next-generation 5nm automotive-grade AI cockpit-driving integrated chip "Longying No. 2" is currently under development.