From：Internet Info Agency 2026-03-24 14:14:00
On March 23, Texas Instruments (TI) introduced two new isolated power modules, the UCC34140-Q1 and UCC33420, leveraging its proprietary IsoShield multi-chip packaging technology to deliver three times the power density of traditional discrete solutions. Designed for demanding applications such as data centers and electric vehicles, these modules significantly enhance efficiency, safety, and reliability. TI stated that IsoShield technology enables engineers to develop smaller, higher-performance power solutions with faster time-to-market, further advancing power semiconductor innovation.
Jaguar Land Rover FY2025/26 Results: Premium Models Drive Recovery, China Market Leads
Baidu Intelligent Cloud Powered Delivery of Over 20 Million L2 ADAS Vehicles Last Year
Leapmotor Hits Record Q1 2026 Revenue Amid Falling Margins, Net Loss Widens to RMB 3.9 Billion
Pateo Appoints Stefan Ortmanns as Head of European Operations to Accelerate Global Expansion
Tesla Unveils Reusable Suspension Clip Patent, Balancing Cabin Quietness and Serviceability
Xiaomi SU7 Ultra and YU7 Roll Out HyperOS 1.16 Full Update with Voice Control, AI Features
Lufang, Chairman of Voyah Auto, Calls 2026 the Decisive Year for New Energy vs. ICE Vehicles
