Domestic Chips Achieve Breakthrough in Mass Vehicle Deployment: Runxinwei, Unisoc, and Maxus Validate Installation in One Million Vehicles

On April 2, Maxus, Runxinwei, and UNISOC signed a mass production and strategic cooperation agreement, marking substantial progress in the large-scale adoption of domestically developed chips in intelligent cockpit systems. The Runxinwei C200 intelligent cockpit system powered by UNISOC’s automotive-grade A7870 chip has entered mass production on Maxus’ all-new Star L pickup and is simultaneously being deployed across multiple key models, including the eDeliver7 light van, serving both domestic and international markets. This solution leverages Runxinwei’s full-stack technology framework—comprising “ZhiRun” (AI models), “ZhiWei” (AIOS operating system), and “ZhiXin” (computing platform)—to achieve deep synergy among chips, operating systems, and AI capabilities. It supports efficient on-device inference and stable integration of mainstream smartphone-vehicle connectivity protocols—including CarPlay, Android Auto, HiCar, and Carlink—and is compatible with over 93% of smartphones globally. To date, intelligent cockpit systems co-developed by Runxinwei with domestic chipmakers such as UNISOC, Horizon Robotics, and AutoChips have surpassed one million units in cumulative vehicle installations. The company operates intelligent manufacturing facilities spanning nearly 40,000 square meters in Nanxun, Huzhou (Zhejiang Province) and Yongchuan, Chongqing, equipped for large-scale automotive-grade production. Additionally, Runxinwei has built a domestic chip mass-production platform covering a compute range from 10K to 100T, offering comprehensive solutions—from entry-level cockpits to high-end integrated cockpit-and-driving domain controllers. In March 2026, Runxinwei joined Dongfeng Liuzhou Motor’s supplier ecosystem, securing定点 awards for intelligent cockpit projects across four vehicle models, including Xinghai and Lingzhi. Its products have passed automakers’ comprehensive QCDD (Quality, Cost, Delivery, Development) evaluations. Meanwhile, the A7870-based C200 system will further expand into global markets such as South America alongside Maxus vehicles. Drawing on its experience optimizing tens of millions of consumer electronics terminals, Runxinwei has introduced the agile development methodologies and user-experience optimization logic from the smartphone industry into the automotive sector. This approach has enabled differentiated capabilities in system boot speed, multitasking fluidity, and long-term stability, effectively bridging the critical gap between chip hardware performance and end-user vehicle experience.