2026 Beijing Auto Show Spotlights Next-Gen Automotive Tech: Supply Chain Firms Drive Core Innovation

During the 2026 Beijing Auto Show, the automotive industry’s competitive focus is shifting from vehicle-level feature specifications to foundational technology stacks. Suppliers are no longer merely supporting partners but are now directly involved in defining the core capabilities of next-generation vehicles. In the field of intelligent driving, “Physical AI” has emerged as a new keyword. QCraft unveiled a Physical AI model based on a “world model + reinforcement learning” framework and launched its “QCraft Chengfeng MAX” platform with over 500 TOPS of computing power, emphasizing AI’s ability to understand the physical world. Momenta announced the mass production debut of its R7 reinforcement learning world model, advancing autonomous driving from “imitation-based driving” toward “autonomous exploration.” WeRide introduced its WRD 3.0 end-to-end ADAS solution, compatible with multiple chip platforms including Qualcomm, NVIDIA, and SiEngine, accelerating the adoption of high-level ADAS. EcarX showcased a Robotaxi prototype and declared its strategic shift toward becoming an AI robotics company. Black Sesame Intelligent launched the “FAD Tianyan” platform supporting L3 autonomous driving, featuring dual-chip high-speed interconnectivity and an ASIL-D safety architecture. Motovis focused on lightweight perception systems and data closed loops to lower the barrier for deploying advanced driver assistance systems. Cockpit-driving integration and central computing have become key directions for the evolution of vehicle electronic and electrical architectures. Quectel showcased three cockpit-integrated solutions supporting on-device deployment of large AI models and introduced products such as in-vehicle AI robots and millimeter-wave radar based on a central-compute satellite architecture. SiEngine unveiled its 5nm automotive-grade “LongYing II” SoC, delivering 200 TOPS of AI performance and supporting multimodal large models and cross-domain task coordination. Black Sesame Intelligent advanced its “Tianyuan Smart Cockpit Plus” platform, integrating cockpit, ADAS, gateway, and MCU functions onto a single chip. ThunderSoft presented its next-generation operating system foundation software designed for central computing. HERE Technologies partnered with Lotus Cars to launch an integrated navigation and highway NOA solution targeting overseas markets. Lenovo Car Computing demonstrated its next-generation central computing platform and AI infrastructure. Drive-by-wire chassis systems—the execution layer for advanced intelligent driving—are gaining increased attention. Nexteer showcased steer-by-wire, brake-by-wire, and EMB (Electro-Mechanical Brake) systems, while promoting a software architecture that integrates braking and steering to enhance execution redundancy for L3+ systems. Marelli displayed drive-by-wire chassis and vehicle dynamics control solutions that improve overall vehicle stability through coordinated control of steering, braking, and suspension. Bosch introduced its next-generation TB193 and TB293 ultrasonic chipset, capable of direct raw signal processing to enhance short-range perception and multi-sensor fusion efficiency. Quectel exhibited millimeter-wave radar based on a central-compute satellite architecture, establishing a full-vehicle 360-degree perception system with unified sensor fusion at the central domain controller. Competition in the new energy vehicle segment is increasingly centered on foundational engineering capabilities. Hozon Powertrain launched the X-Range C15 Direct Drive powertrain system, which integrates engine, transmission, motor, and power electronics, enabling rapid transition from pure electric platforms to hybrid variants. ElringKlinger showcased battery cell connection systems, lightweight structural components, and thermal management sealing solutions, with its cell connection system already in mass production. Materials technology is now directly influencing smart cockpit experiences. Eastman participated as an independent exhibitor for the first time, presenting six technology solutions including HOE holographic transparent displays, integrated HUD/ADAS glass, and acoustic PVB interlayers. Its Saflex Evoca RSL high-rigidity acoustic film improves NVH performance, while the XIR.SR film ensures consistent reflectivity across large-curved glass surfaces. ElringKlinger also introduced thermoplastic components, high-performance thermal insulation materials, and battery thermal isolation solutions. This year’s auto show demonstrates that automotive technology competition has deepened across multiple dimensions—including foundational architectures, actuation systems, engineering integration, and functional materials—with suppliers playing an increasingly significant role in shaping technological roadmaps.