Multiple Automakers and Institutions Unveil New Technologies in Smart Connectivity, Autonomous Driving, and New Energy

Hyundai and Kia have unveiled Plasma Care UVC, an in-vehicle sterilization technology that combines Far-UVC light (200–230 nm) with plasma light sources to disinfect cabin air and eliminate odors—even in occupied vehicles. The system has completed laboratory and full-vehicle testing and is now undergoing validation against international safety standards. The United Nations Economic Commission for Europe (UNECE) has adopted the world’s first regulatory framework for fully automated driving systems (ADS), establishing unified safety requirements, verification methods, and safety management systems applicable across diverse scenarios including highways and urban environments. The regulation will take effect in approximately one month. The UK-based PIVOT project consortium has introduced a next-generation aluminum-cast subframe. Leveraging advanced casting techniques and topology optimization, it achieves weight reductions of 17% and 35% for front and rear subframes, respectively. The front subframe has already entered tooling production. Digi International has launched the TX65 series of automotive-grade industrial routers, integrating 5G, Wi-Fi 7, GNSS, and serial communication capabilities. Built on Qualcomm’s SDX72 platform, the routers support dual-SIM dual-standby operation and remote management, making them ideal for mission-critical vehicles such as public transit buses and emergency response units. Ford has filed multiple patents: a retractable in-car keyboard stowed beneath the center display, offering adjustable angles and wireless connectivity; an intelligent door and window control system that automatically adjusts locking status and operational permissions based on rear-seat occupant type; and a vehicle vision system capable of activating visual alerts during nighttime or adverse weather conditions while notifying emergency responders. Tesla has filed a design patent for Cybercab wheels featuring fully enclosed aerodynamic wheel covers with flexible outer edges, combined with different-sized front and rear wheels and front-wheel drive. Separately, Tesla has also patented a hybrid active suspension system that integrates active motors, air springs, and passive dampers to enable layered control—enhancing ride comfort while reducing energy consumption. Infineon Technologies and Amazon Web Services (AWS) have jointly launched a cloud-based virtual evaluation platform for microcontrollers (MCUs), enabling online development of automotive-grade MCUs. The platform is expected to be available to select customers in Q3 2026. Infineon also announced mass production of its CTRX8188F 8Tx8Rx radar transceiver, which supports centralized radar architectures and 4D imaging. Researchers at the University of Toronto have developed a novel LiDAR system capable of simultaneously capturing target distance, velocity, material properties, and polarization information in a single measurement—significantly enhancing perception in complex environments. rFpro has released the AV elevate IN CABIN simulation software package for high-fidelity testing of in-cabin driver and occupant monitoring systems, supporting simulations of facial expressions and in-cabin energy propagation. Vishay has introduced the automotive-grade optocoupler VOLA617A, rated for 800V+ high-voltage platforms with 5,000 VRMS isolation voltage, suitable for onboard chargers and DC/DC converters. Fraunhofer IAF has developed a bidirectional DC charging module based on 1200V gallium nitride (GaN) devices, covering battery voltage ranges from 150V to 920V. The 3kW prototype measures just 8.3 liters in volume and is suited for mobile charging and vehicle-to-grid (V2G) applications. The NICS team at the University of Málaga has developed a cybersecurity protection system for EV charging stations, integrating AI, blockchain, and situational awareness technologies to enable attack tracing and anomaly detection. Texas Instruments has launched the BQ79826Z-Q1 battery monitor, featuring an integrated electrochemical impedance spectroscopy (EIS) engine. It supports monitoring of up to 26 cells with measurement accuracy below 2 mV and offers EIS speeds five times faster than previous generations. ROHM has introduced the AG16xFNxx series of 80V power MOSFETs designed for 48V automotive power systems. Utilizing compact packaging and copper clip interconnect technology, these MOSFETs reduce conduction losses and improve thermal performance. Sensirion has released the automotive-grade hydrogen sensor STC42A for early detection of hydrogen emissions during battery thermal runaway. The sensor has achieved AEC-Q100 Grade 2 certification. Porsche has filed a patent for a novel powertrain architecture that combines cylinder banks with distinct functions and electric motors, enabling pure electric, range-extended, and hybrid modes within a single unified system. Researchers at Sungkyunkwan University have developed a liquid metal hydrogel electrolyte exhibiting 900% stretchability at –20°C and retaining 98% of its performance after 45,000 cycles. Nipsea Group has developed an ultra-black coating composed of carbon black and carbon nanotubes, achieving an average visible-light absorption rate of 99.90%, along with excellent water resistance and environmental stability. A Canadian research team has developed biochar-enhanced sheet molding compound (SMC) composites using pyrolyzed forestry waste as a substitute for conventional fillers. Prototype seat backrests have been fabricated, though flame-retardant performance remains insufficient. Monash University has proposed a low-temperature, slow-ramp metallurgical process that forms highly ordered nanostructures in titanium-, hafnium-, and other alloy systems, achieving twice the strength of conventionally processed materials. SK Keyfoundry has developed an on-chip EMC protection technology based on Bi-SCR, now in mass production using 0.13-micron BCD process nodes, significantly enhancing electromagnetic compatibility for automotive-grade chips. Researchers at POSTECH (Pohang University of Science and Technology) have developed a zinc oxide/tellurium heterojunction transistor exhibiting dual negative differential transconductance characteristics, enabling a single device to perform functions typically requiring multiple transistors—and accelerating data processing by fourfold. Rice University has developed a Python-based tool for automated analysis of X-ray diffraction data, enabling efficient identification of crystal defects in diamond and gallium nitride. NVIDIA has launched Halos for Robotics, a full-stack robotic safety system integrating the IGX Thor computing platform and safety-certified software stack. Agility Robotics has already deployed it in humanoid robots. Researchers at the University of Gothenburg have developed a soft-bodied inchworm-inspired robot with no rigid components, using polymer-based artificial muscles to achieve autonomous crawling under low voltage—ideal for pipeline inspection and similar applications. Tekion has launched T1 Pro, an AI agent platform for automotive retail, featuring AI agents for sales, financing, and insurance to automate dealership workflows. Oregon State University has developed a photosensitive memory device that integrates light sensing, storage, and computing functions, mimicking neural synapse mechanisms. The University of Arizona has proposed an acoustic neuromorphic computing chip that processes information using nonlinear sound waves, improving energy efficiency and parallel processing capabilities. Zhejiang University has developed a reinforcement learning-based drone control system capable of autonomously navigating through dynamic, narrow gaps—successfully validated in real-world flight tests. Anhui University has developed an optical fiber-driven micro-gripper that uses near-infrared laser to control hydrogel contraction, enabling micrometer-scale grasping with micronewton-level gripping force. KAIST (Korea Advanced Institute of Science and Technology) has developed a highly stretchable, self-powered piezoelectric sensor that delivers stable output signals even at 668% strain, suitable for wearable devices and electronic skin. Sony and imec have jointly introduced a high-density backside interconnect module employing localized backside dielectric isolation technology, enhancing interconnect density and alignment tolerance in 3D chip stacking.