China's First Automotive-Grade Chip Packaging and Testing Plant Launches in Shanghai

On March 10, JCET Automotive Electronics (Shanghai) Co., Ltd. officially commenced operations in the Lingang Special Area of Shanghai, becoming China’s first specialized automotive-grade semiconductor packaging and testing facility dedicated to automotive electronics and robotics applications. The project, led by JCET Group—a global leader in semiconductor packaging and testing—focuses on advanced automotive-grade chip packaging and testing, filling a critical gap in Shanghai’s automotive chip manufacturing supply chain, particularly in back-end processes. The launch of this facility not only strengthens China’s self-reliance and control over its integrated circuit supply chain but also represents a crucial step toward overcoming technological barriers in advanced manufacturing. Attendees at the inauguration ceremony included Chen Jinshan, Member of the Standing Committee of the Shanghai Municipal Party Committee and Secretary of the Party Working Committee of Lingang Special Area, and Wang Cuijun, General Manager of China Resources Group.