Black Sesame Intelligence and Dongfeng Motor Launch China's First Single-Chip Integrated Cockpit-Driving Mass-Production Platform

Black Sesame Technologies and Dongfeng Motor have entered into a platform-level strategic partnership to jointly launch the Tianyuan Smart Cabin Plus, a mass-production-ready integrated cockpit-and-driving platform. Powered by Black Sesame’s self-developed Wudang C1296 chip, the platform debuts on the Dongfeng Yipai 007 model and is scheduled for expansion across more Dongfeng vehicle models between 2024 and 2025. This platform represents China’s first mass-produced solution that deeply integrates intelligent cockpit and advanced driver-assistance functions using a single domestically developed chip. On the intelligent cockpit side, it supports features such as a 3D vehicle-control desktop, SR lane-level navigation, multi-device interconnectivity, and AI large-model-based multimodal interaction. For intelligent driving, it enables full-scenario L2+ driving assistance, FAPA (Fusion Automated Parking Assist), and PDC (Parking Distance Control). The Wudang C1296 chip is fabricated on a 7nm automotive-grade process and integrates a CPU, GPU, NPU, DSP, ISP, MCU, and gateway module, enabling convergence across four domains: cockpit, autonomous driving, vehicle control, and gateway functions. Through unified computing resource scheduling and high-speed shared memory architecture, cross-domain data interaction latency is reduced to the microsecond level. Additionally, a hardware-level functional safety isolation mechanism ensures compliance with ASIL-D functional safety standards and EVITA Full cybersecurity requirements. Compared with traditional distributed electronic/electrical (E/E) architectures, this solution reduces overall vehicle costs by approximately 30% and significantly enhances system iteration flexibility. Previously, industry efforts toward cockpit-driving integration largely relied on physical integration of multiple chips or foreign-sourced silicon; this collaboration marks the first time a fully domestic, end-to-end closed-loop solution—from chip to vehicle platform—has been achieved. Black Sesame Technologies has already achieved mass production with its Huashan A1000 series chips in vehicles from Geely, BYD, FAW, and others, with cumulative shipments projected to exceed 10 million units by 2025. Around the Wudang platform, the company has also partnered with Continental, Aptiv, Joyson Intelligence, and Banma Smart Mobility to build a comprehensive ecosystem spanning chips, operating systems, middleware, algorithms, and domain controllers. This partnership signifies that domestically developed integrated cockpit-and-driving technology has entered the phase of large-scale commercial deployment and is poised to accelerate adoption from premium vehicles into the mainstream market.