RoboSense Unveils "Genesis" Architecture and Dual Flagship Chips—Phoenix and Peacock—Set for 2026 Mass Production

On April 21, 2026, RoboSense held a Technology Open Day in Shenzhen, where it unveiled its chip strategy and technical achievements for the first time in a systematic manner. The company introduced its new “Genesis” digital architecture and launched two flagship SPAD-SoC chips based on this architecture—the Phoenix series and the Peacock series—both scheduled for mass production within 2026. The “Genesis” architecture is a rapidly evolvable SPAD-SoC platform designed for automotive, robotics, industrial, and consumer electronics applications. It features a four-layer structure: - The foundational process layer adopts a 28nm automotive-grade process, reducing core area by 40% and power consumption by 30%. - The third-generation ultra-sensitive SPAD photodetection layer achieves a photon detection efficiency (PDE) of 45%. - The second-generation 3D stacking technology significantly reduces noise. - The core computing layer integrates a 4,320-core heterogeneous computing array capable of processing 495 billion point cloud samples per second, supported by high-bandwidth on-chip data pathways enabling perception at the tens-of-millions-pixel level. - The algorithm acceleration layer incorporates an interference-resistance engine, achieving 99.9% immunity against sunlight-induced noise and crosstalk from opposing LiDAR units. - The safety and reliability layer embeds an ASIL B functional safety architecture, ensuring stable operation across temperatures ranging from -40°C to 125°C. The Phoenix chip employs a single-die, single-optical-path design with native 2,160-line resolution and a point cloud resolution of 2,160 × 1,900. It offers a maximum detection range of 600 meters and can identify objects as small as 13 × 17 cm at distances beyond 150 meters. The series includes five variants, supporting LiDAR product designs ranging from 2,160 lines down to 240 lines. A 4-megapixel LiDAR solution based on the Phoenix chip has already secured定点 (定点 here refers to official selection or nomination) from a leading automaker and is slated for vehicle integration in 2026. The Peacock chip integrates a high-density 640 × 480 SPAD focal plane array, delivering VGA-level resolution and outputting dense 3D depth images with millimeter-level precision—six times higher than the previous generation. It offers a maximum field of view of 180° × 135°, a minimum detection distance under 5 cm, and a frame rate of 10–30 Hz, aligning for the first time with standard camera frame rates. This chip targets applications such as automotive solid-state blind-spot coverage, standardized robotic vision modules, and fused sensor systems. The Peacock chip was announced as “mass-production ready upon launch,” with large-scale shipments planned for Q3 2026; limited customer deliveries have already commenced. At the event, RoboSense also showcased 2K near-infrared imaging generated directly via the Phoenix chip’s photosensing capability, simultaneously outputting grayscale intensity and 3D depth information at a resolution of 2,160 × 1,900.