Black Sesame Smart's Huashan A2000 Chip Secures Major OEM定点, Set for 2026 Mass Production in L2+ to L3 Autonomous Vehicles

Black Sesame Technologies announced that its intelligent driving solution, jointly developed with GCIC (China Intelligent and Connected Vehicles Innovation Center) based on the Huashan A2000 full-scenario general-purpose ADAS chip, has secured a定点 award from a leading Chinese automaker. The solution covers full-scenario functionalities ranging from L2+ to L3, with the first mass-produced vehicles expected to launch in 2026. The Huashan A2000 is built on a 7nm process node, delivering performance comparable to the world’s top-tier intelligent driving chips. It supports FP16/FP8 floating-point operations and multiple integer precisions, and comes equipped with the mature AI toolchain BaRT for efficient model training and deployment. In January this year, Black Sesame also unveiled its FAD 2.0 open platform based on the A2000, which includes high-performance hardware, a software SDK, the AI toolchain, and reference models. Designed to support a third-party ecosystem, the platform is scheduled for release in Q1 2026.