From：Internet Info Agency 2026-09-17 13:24:10
On September 16, 2026, local time, onsemi announced the launch of its Embedded Power Platform (EPP). Built on a 12-inch silicon wafer as the packaging substrate, the platform integrates multiple dies into a single silicon device, achieving 3 to 5 times the power density of existing solutions. The EPP supports integration of silicon, silicon carbide, and gallium nitride technologies within a wafer-level architecture, embedding components such as field-effect transistors, drivers, and controllers into a single package. In an early solid-state circuit breaker design based on EPP, the solution reduced size by approximately 50% and lowered operating temperature by about 20% compared to current designs. In electric vehicle traction inverter applications, EPP delivers up to a 4x increase in power density and a 15% reduction in power loss. onsemi expects to begin sampling EPP to customers in 2026. Subaru is collaborating with onsemi to evaluate how the platform can support future electrified vehicle architectures.
