onsemi Launches Embedded Power Platform EPP, Sampling to Customers Expected to Begin in 2026

On September 16, 2026, local time, onsemi announced the launch of its Embedded Power Platform (EPP). Built on a 12-inch silicon wafer as the packaging substrate, the platform integrates multiple dies into a single silicon device, achieving 3 to 5 times the power density of existing solutions. The EPP supports integration of silicon, silicon carbide, and gallium nitride technologies within a wafer-level architecture, embedding components such as field-effect transistors, drivers, and controllers into a single package. In an early solid-state circuit breaker design based on EPP, the solution reduced size by approximately 50% and lowered operating temperature by about 20% compared to current designs. In electric vehicle traction inverter applications, EPP delivers up to a 4x increase in power density and a 15% reduction in power loss. onsemi expects to begin sampling EPP to customers in 2026. Subaru is collaborating with onsemi to evaluate how the platform can support future electrified vehicle architectures.