Bosch Announces Plan to Establish Semiconductor Division on January 1, 2028

On November 4, Bosch announced plans to establish a dedicated semiconductor division on January 1, 2028. The move is part of a global business restructuring of the Bosch Group and Bosch Mobility, and the newly established semiconductor division will remain under Bosch Mobility. Currently, Bosch's semiconductor business sits within its Automotive Electronics division. According to business targets disclosed by Bosch, the company aims to grow its semiconductor business sales to 5 billion euros by 2030. In terms of business layout, while continuing to deepen its presence in automotive and consumer electronics such as smartphones and smart wearable devices, Bosch will also turn its attention to emerging markets including robotics and AI data centers. Bosch chips have already been deployed in the robotics sector, according to the company. Bosch's semiconductor business has accumulated more than 60 years of expertise, with its competitive advantages centered on market and technology leadership in micro-electromechanical systems (MEMS) sensors and its ability to deeply integrate semiconductors into system businesses, particularly in silicon carbide (SiC) chips and application-specific integrated circuits (ASICs). Bosch mentioned the Chinese market in its announcement, stating that it is currently collaborating with local Chinese automakers, consumer technology brands and robotics companies.