Xizhi Tech Secures Over RMB 100 Million in Series A Funding, Total Financing Exceeds RMB 5 Billion

Xizhi Technology recently announced the completion of its Series A financing round, raising over RMB 100 million. This round was participated in by Tongge Ventures and Xinhe Capital, with existing shareholder Hangzhou Capital making an additional investment. Including the earlier Pre-A round completed in the first half of the year, Xizhi Technology has now raised more than RMB 300 million in total funding for 2026. The company has also initiated its Series B financing round. The proceeds from this round will be used to build automotive power module production lines at its Hangzhou facility and computing power supply module production lines at its Suzhou facility. Founded on January 1, 2022, Xizhi Technology currently employs 120 R&D personnel, accounting for 50% of its total workforce. To date, the company has secured cumulative investments exceeding RMB 500 million and operates a technology center in Shanghai as well as manufacturing bases in Suzhou and Hangzhou. Its core business focuses on applying high-frequency technology, packaging technology, and chip technology in the power electronics industry, driving global adoption of high-frequency power electronics and wide-bandgap semiconductor technologies.